Technology

Q-DPAK

FOLP® Technology

Flip Chip QFN with Cu-pillar

Power QFN with Cu-Clip

Multi Chip Module Package

High Reliability WLP Technology　

Copper Pillar

Stacked Die

Ultra Thin & Small Package

Paste for Power Semiconductor

Nin1 Multi Package

Wettable Flank

EM Noise Shield

WLP in Development

Open Cavity Package

Chip on Lead

DPCC™ ／ Thick Copper Substrate

High Heat Dissipation Substrate

Simulation Technology

Quality