Technology

Flip Chip QFN with Cu-pillar

Open Cavity Package

Chip on Lead

Stacked Die

Power QFN with Cu-Clip

Ultra Thin & Small Package

Multi Chip Module Package

Paste for Power Semiconductor

Nin1 Multi Package

Wettable Flank

EM Noise Shield

Copper Pillar

High Reliability WLP Technology　

WLP in Development

FOLP® Technology

Quality

Simulation Technology

High Heat Dissipation Substrate

DPCC™ ／ Thick Copper Substrate