High Heat Dissipation Substrate

■ Background

In EVs, 5G communication systems, and data center servers, heat generation is a serious issue that directly affects the performance and life of equipment. Therefore, it is important to suppress heat generation itself.
AOI Electronics offers high heat dissipation substrates that combine substrate materials with excellent heat dissipation and highly reliable wiring materials.

【Applications of this technology】
　　Automotive power supply boards , Industrial semiconductor control boards , Large display control boards , Server power supply boards

■ Feature

High-definition wiring formation by two methods

DPCC : Direct Printed Copper on Ceramics base substrate

・Wiring thickness can be widely from 10 to 1,000 μm(*) 　　(* In the case of DPCC, it depends on printing conditions)
・Various substrate materials are available　 (alumina, aluminum nitride with higher thermal conductivity, silicon nitride, etc.)
・High quality assurance by One-Stop manufacturing, available both as substrate and after device mounting.

Device analysis with the aluminum nitride base material

・Proposal by Thermal Simulation
　Left: Device analysis example of aluminum nitride substrate
　(Size 3mm□　 Applied power 1W)

■ Structure

① Thick wiring structure by sintered paste + screen printing
② Highly reliable structure by plating + thin-film photolithography

■ Application

　　　Automotive　　Power Supply Substrate, ECU Substrate
　　　Industrial　　　　Equipment control boards for semiconductor devices, refrigeration elements
　　　Lighting LED 　Lighting Substrates, Large Display Control Substrates