Die Attach Material for Power Semiconductors
In order to save energy and power, it is required to improve the power efficiency of power semiconductors.
SiC and GaN, which are attracting attention as next-generation power semiconductors are required to have materials that can withstand high operating temperatures.
By using sintered silver paste or Sn-Cu-based lead paste, it is possible to realize a paste layer with low resistance, high thermal conductivity, high heat resistance, and high reliability compared to conventional Ag paste.
Feature
- Low electrical resistance (10 to 15μΩ・cm)
- High heat conduction
- High reliability
- Lead-free
- Low temperature sintering (200℃～250℃)
- High heat resistance (900℃ or higher)
Application
- Solder replacement
- Inverter
- Switched-mode power supply
- Next generation power semiconductors (SiC,GaN)
