DPCC™ : Direct Printed Copper on Ceramics base substrate
■Feature
① Thickness Over 1,000μm* （* Depends On Printing Condition）
・Thickness suitable for power semiconductor substrates
・Can form areas of different thickness on the same wiring
② Pattern spacing Min.25μm* （* Depends On Printing Condition）
・Wiring by screen printing using copper paste
・High-density wiring beyond conventional DBC/AMB etch rules
③ Various Ceramics Substrate
・Available Cu wiring patterns on various ceramic substrates
・AL2O3 , ALN , Si3N4
■Shape of wiring
・Good rectangular shape and flatness on surface
・Form L/S that is difficult to achieve with etching method
