Structure
Cross Section
Outer view
ROADMAP
FOLP® FEATURES
Short cycle time :
Horizontal specialization process
*Wafer Bumping /OUME-ELECTRONICS
*Substrate(RDL) Process/AOI-ELECTRONICS ASAHIMACHI PLANT
*Assembly +TEST/T＆R Process/AOI-ELECTRONICS TAKAMATSU PLANT
High Efficiency :
AOI use the Low Dk/Df substrate materials for RF 5G devices.
High Yield :
KGD +KG Substrate Combination
High Reliability :
-Modified epoxy resin
-Solder materials of various composition attach
Low Cost :
-No use PI system
-In a batch-molding method without Cu-pillar capillary underfill
-Adopting the mechanical de-bonding system
