Cu-clips have lower resistance and inductance than multiple wire bonds interconnected high performance MOSFETs,
and Improves thermal performance. The Cu-Clip QFN package targets power management products, such as DCDC converters and motor drivers. It is expected as a device for high power density and high frequency switching.
Feature
- Multi-chip power QFN
- The low-side MOSFET has a source-down structure for resistance and high heat dissipation
- Advantages of small footprint and small parasitic inductance
- Lead-free solder is applied to the die attach material
- Wettable flank structure for automotive
Structure
Application
- DCDC converter
- Motor Driver
- Server power supply
- Power Management
