Recently, there has been an increasing demand for flip-chip packages that use Cu-pillar bumps for power supply ICs
in order to support miniaturization and high-speed switching frequencies.
Advantage is the turnkey process. We propose excellent flip-chip packages by fusing Cu-pillar forming technology
with package assembly technology on wafers.
Feature
- Turnkey services (6" & 8" wafer)
- Downsizing (60% size reduction compared with wire type)
- Reduction of signal inductance (For high speed switching frequencies)
- Large current (low resistance)
- Wettable flank structure option for automotive
Structure
Application
・ DCDC converter
・ LDO / Low Dropout Regulator
・ PMIC / Power Management
・ High speed switching device
・ RF switch, Antenna tuning switch
