Wettable Flanks for non-lead package
Automotive applications requires smaller semiconductor packaging solutions.
Leadless packages such as QFN are desirable as packaging solutions that meet the space-saving and size-limited needs of printed circuit board designs.
For Non-lead packages, the side fillet property of the solder is important in order to pass the automatic visual inspection.
Pre-Mold frame Type
Dimple Type
Step lead Type
Feature
- Applicable to Non-lead packages such as QFN.
- High mounting solder bondability reliability
- Good solder fillet property. Solder fillet height 0.10 mm or more.
- High visual inspection.
Structure
Application
- Automotive device
DCDC converter, LDO, Power Management IC, ADAS, Camera module
