Miniature DFN/QFN with Chip On Lead structure.
By placing the chip directly on the leads, we can remove the island, which is a must for conventional packages.
Also, an insulated DAF (Die Attach Film) is used for bonding the chip and the lead to prevent a short circuit.
Package size can be shrunk without changing the chip size and number of pins.
Feature
- Downsizing of the package
- Conventional chips can be used
Structure
Application
- LDO
- Battery protection IC
- Operational amplifiers
- DCDC converter
