Nin1 Multi package (Type of MIS)
There is a growing needs for higher density and higher functionality, especially in automotive.
We propose Nin1 multi package for fine layout patterns that cannot be handled by lead frames. In addition, because it is a lead frame base, it has excellent low resistance and heat dissipation, making it ideal for power devices.
Feature
- Uses a pre-molded lead frame
- Large area metal and partial fine line/space
- Passive parts can also be installed ;For example, capacitors and inductors
- Size reduction compared with conventional Package
- Wettable flank structure for automotive
Package Bottom
Package Top (Heatsink side)
Structure
Application
- DC-DC converter IC
- BLDC Motor Driver
- Server power supply (POL)
- RF front end module (GaN HEMT)
