Multi Chip Module (MCM) Package
Multi-chip modules with passive components are being developed to increase power density for industrial equipment and automotive and to reduce electric noise.
We propose inexpensive and highly functional packages based on lead frames.
Feature
- Applicable to Non-lead packages such as QFN.
- Passive parts can also be installed. For example, capacitors and inductors.
- High density
Structure
Application
- DC-DC converter IC
- Server power supply (POL)
- Power Management IC
- Motor Driver for Automotive
