Stacked Die
It's possible to reduce the footprint of a board by mounting multiple chips in one package.
As a way to further reduce the footprint, we have a technology that allows us to mount die on top of die.
An insulated DAF (Die Attach Film) is used for chip-to-chip bonding to prevent short circuits.
Feature
- Reduce the footprint
- Downsizing of the package
- Conventional chips can be used
- High electric insulation
Structure
Application
- Battery protection IC
- DCDC converter
- MOS Relay switch
- Power Management IC
