- February 26, 2025
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AOI Electronics to participate at the IMAPS Device Packaging Conference 2025
- February 5, 2025
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Participation in the Selected Project for "Technology Development for Automation of Post-Processing, Including Advanced Packaging" under the NEDO Public Offering
- October 7, 2024
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AOI Electronics to participate at SEMICON Japan / APCS 2024
- September 27, 2024
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AOI Electronics to participate at the IMAPS Symposium 2024
- June 4, 2024
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AOI Electronics to participate at SEMICON WEST 2024
- April 23, 2024
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AOI Electronics to participate at the ECTC 2024
- April 17, 2024
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AOI Electronics to participate at the IMAPS POWER ELECTRONICS 2024
- March 7, 2024
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AOI technical article about power module packaging to publish on IMAPS Advancing Microelectronics Magazine 2024 Volume 51
- March 4, 2024
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AOI Electronics to participate at the IMAPS DPC2024
- December 1, 2023
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Added a new technology "DPCC" to our Technology page
