News

AOI Electronics will be participating in the upcoming  ISAPP2025(International Symposium on Advanced Power Packaging 2025).

　<Dates>
       　 November 5-7, 2025
　<Venue>
        　Fukuoka International Congress Center
　<URL>
       　 https://isapp.jp/

[Presentation Overview]
　<Presentation Time >
        　November 6,  10:00am～10:20am
　<Speaker>
        　Yoshiaki Aizawa
　<Title >
       　Chip-Embedded Core Power Semiconductor Packaging by Panel-level Technology
       　https://isapp.jp/program