Participation in ECTC2026 May 26-29 Florida
May 15, 2026
We will be exhibiting at the 76th ECTC
May 26–29, 2026
＜Venue＞
JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway, Orlando, Florida, USA, 32837
・Chiplet integration technology
・Advanced power panel-level packaging technology
・Session Title: Session 04: Breakthrough in Pitch Scaling with Advanced Bonding Technology
・Presentation Topic: Pillar-Suspended Bridge (PSB); Fabrication Process Verification and Interconnect Design for 25-Micron Pitch Die-to-Die Interface
・Date & Time: Wednesday, May 27, 12:15 PM – 12:35 PM
・Venue: Tuscany E (The Ritz-Carlton)
Click here for technical materials →→→→
