AOI technical article about power module packaging to publish on IMAPS Advancing Microelectronics Magazine 2024 Volume 51
Engaging to save energy and carbon neutral society, demand of "SiC" and "GaN", which have advantages, including high temperature and high speed operation and low on-switch resistance, are increasing in electric vehicle, charging infrastructure and renewable energy.
We have developed new inverter sub-power module package with very thin, double-sided heat-dissipating structure with low thermal resistance, all interconnected (wired) by copper plating.
The very simple structure without wire bonds at the panel level, makes it possible to connect a large number of chips at high density.
This new module package uses the same 300 mm square panel process as the chiplet integrated package with PSB (Pillar-Suspended Bridge), and we will expand the applications area in power electronics.
AOI Electronics will disclose this new technology at the upcoming IMAPS DPC2024 between March 18 and 21, 2024.
[Entry description]
Scalable core package for Power module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN
[IMAPS DPC2024]
<Dates> March 18 - 21, 2024
<Venue>the WeKoPa Resort and Conference Center in Fort McDowell, AZ
<URL>https://imaps.org/page/Device-Packaging
The article of this new technology can be read on IMAPS Advancing Microelectronics Magazine 2024 Volume 51.
<Magazine>
IMAPS Advancing Microelectronics Magazine 2024, Volume 51