News

AOI Electronics will be participating in the upcoming IMAPS ADVANCED PACKAGING FOR POWER ELECTRONICS 2024 between May 8 to 9, 2024.

[Entry description]
Proposal of Chip Embedded Core Power Module Package with Double-Side Direct Cu Plating Connection to power chips for Higher Reliability Suitable for SiC and GaN    

[IMAPS ADVANCED PACKAGING FOR POWER ELECTRONICS 2024]    
<Dates> May 8 - 9, 2024
<Venue>Crown Plaza Boston-Woburn, MA        
<URL>https://imaps.org/page/PowerPack2024