News

AOI Electronics will be participating in the upcoming  IMAPS DPC2024 between March 18 and 21, 2024.
・Oral presentation: March 19, 2024
・Poster session     : March 20, 2024

[Entry description]
Scalable core package for Power module with Double-Sided Cooling Capability Applying Fan-out Panel-Level Process Suitable for SiC and GaN


[IMAPS DPC2024]
<Dates> March 18 - 21, 2024
<Venue>the WeKoPa Resort and Conference Center in Fort McDowell, AZ
<URL>https://imaps.org/page/Device-Packaging