News

We are pleased to announce our participation in this project in relation to the selection of "Technology development for automation of post-processing, including advanced packaging" under the NEDO public offering "Post-5G information and communication system infrastructure strengthening research and development project / Development of advanced semiconductor manufacturing technology (contracted)".

〇SATAS　　
https://satas-cip.jp/nedo_accept202411/#

〇Ministry of Economy, Trade and Industry
https://www.meti.go.jp/policy/mono_info_service/joho/post5g/20241106.html

〇NEDO　　
https://www.nedo.go.jp/koubo/IT3_100330.html