AOI Electronics to participate at the IMAPS Device Packaging Conference 2025
February 26, 2025
AOI Electronics will be participating in the upcoming IMAPS Device Packaging Conference 2025 between March 3 and 6, 2025.
[Entry description]
「Panel Level Package: Reliability evaluation of double-sided direct copper plated interconnects on embedded power chips by thermal and electrical stress test」
[IMAPS DPC2025]
<Dates> March 3 - 6, 2025
<Venue>Sheraton Grand at Wild Horse Pass in Phoenix, Arizona, USA
＜URL＞https://imaps.org/page/IMAPS2025