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AOI ELECTRONICS CO., LTD.

455-1, Kohzai-Minamimachi,
Takamatsu-City, Kagawa, 761-8014, Japan

© 2021 AOI ELECTRONICS CO.,LTD.

FOLP® Technology
Flip Chip QFN with Cu-pillar
Power QFN with Cu-clip
Open Cavity Package
High Heat Dissipation Substrate
Ultra Thin & Small Package
High reliability WLP Technology
Technology
Technology
Assembly Services
Assembly Services
Testing Services
Testing Services
Others Technology
Others Technology

News

Read more
March 31, 2025
Notice of Conclusion of Sales Contract at Sharp Mie Plant No. 1
February 26, 2025
AOI Electronics to participate at the IEEE Applied Power Electronics Conference 2025

Location

AOI ELECTRONICS HEAD QUARTERS TAKAMATSU PLANT

AOI ELECTRONICS
HEAD QUARTERS
TAKAMATSU PLANT

Packaging Technology

AOI ELECTRONICS KANONJI PLANT

AOI ELECTRONICS
KANONJI PLANT
Fine Pitch RDL Technology

HAYAMA INDUSTRIES

AOI ELECTRONICS ASAHIMACHI PLANT
HAYAMA INDUSTRIES
Plating Technology for RDL

HIGH COMPONENTS AOMORI

HIGH COMPONENTS AOMORI
RF TEST Technology

OUME ELECTRONICS

OUME ELECTRONICS
Wafer Level Package Technology

AOI ELECTRONICS

AOI ELECTRONICS
TOKYO SALES OFFICE

Contact

AOI ELECTRONICS CO., LTD.

455-1, Kohzai-Minamimachi,
Takamatsu-City, Kagawa, 761-8014, Japan

  • Home
  • News
  • Technology
  • Assembly Services
  • Testing Services
  • Thickfilm thermal printheads, MEMS, Others
  • About us
  • Location
  • Contact us
  • Privacy Policy

© 2021 AOI ELECTRONICS CO.,LTD.