AOI ELECTRONICS

AOI ELECTRONICS CO., LTD.

455-1, Kohzai-Minamimachi,
Takamatsu-City, Kagawa, 761-8014, Japan

© 2021 AOI ELECTRONICS CO.,LTD.

FOLP® Technology

Flip Chip QFN with Cu-pillar

Power QFN with Cu-clip

Open Cavity Package

High Heat Dissipation Substrate

Ultra Thin & Small Package

High reliability WLP Technology

Technology

Technology

Assembly Services

Assembly Services

Testing Services

Testing Services

Others Technology

Others Technology

News

Read more

June 17, 2025: AOI Electronics to participate at the SEMISOL2025

May 22, 2025: AOI Electronics to participate at ISPSD 2025

Location

AOI ELECTRONICS HEAD QUARTERS TAKAMATSU PLANT

AOI ELECTRONICS
HEAD QUARTERS
TAKAMATSU PLANT
Packaging Technology

AOI ELECTRONICS KANONJI PLANT

AOI ELECTRONICS
KANONJI PLANT
Fine Pitch RDL Technology

HAYAMA INDUSTRIES

AOI ELECTRONICS ASAHIMACHI PLANT
HAYAMA INDUSTRIES
Plating Technology for RDL

HIGH COMPONENTS AOMORI

HIGH COMPONENTS AOMORI
RF TEST Technology

OUME ELECTRONICS

OUME ELECTRONICS
Wafer Level Package Technology

AOI ELECTRONICS

AOI ELECTRONICS
TOKYO SALES OFFICE