AOI Electronics to participate at the ECTC 2025
AOI Electronics will be participating in the upcoming the ECTC 2025 between May 27 to 30, 2025(Program Sessions & Exhibition).
■ECTC 2025
<Dates> May 27 - 30, 2025
<Venue>Gaylord Texan Resort & Convention Center Dallas, TX, USA
<URL>https://ectc.net/index.cfm
■Program Sessions : May 29, 2025 (2:00PM~)
[Title]
Pillar-Suspended Bridge (PSB); Transmission Simulation and Fabrication Process of 2-Micron Diameter / 5-Micron Pitch Dry Etched Stacked Via in Low-k Polymer for High Performance Redistribution Layer Bridge (RDL Bridge)
[Presentation details]
We designed 2-micron diameter, 5-micron pitch stacked via and 2-micron line width low-k polymer multilayer interconnect for Pillar-Suspended Bridge (PSB) chiplet integration technology. As a result, excellent simulation results of transmission characteristics at bandwidths of >10 Gb/s/Ch were obtained. Furthermore, the fabrication conditions of the fine stacked via were obtained.
■Exhibition Booth
［Booth Number］
132
［Exhibit Hall Opening hours］
May 28: 9:00 am–12:30pm, 2:00 – 6:30 pm
May 29: 9:00 am–12:30pm, 2:00 - 4:00 pm