With the technological progress of society, the needs for highly reliable and high speed sensing applications are increasing, and the development of sensors to realize them is becoming more important.
With this package, the sensing area can be partially opened by transfer molding using film assist.
This process can expose only the required part of the chip sensing area and coat with resin to cover area.
This package design and propose openings and package sizes that meet the needs of our customers.
Feature
- High precision
- Miniature DFN/QFN or PLPackage
- Good productivity
- High reliability(Materially,MSL1 passed)
- Release-film reduces stress on the chip
- Cost advantage
Structure
Application
- Optical sensor
- Pressure sensor
- Temperature sensor
- Humidity sensor
- Environmental sensor